SHT10 SENSOR HUMI/TEMP 5V DTL 4.5% SMD
Product Attributes |
Select All |
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Categories |
Sensors, Transducers |
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Manufacturer |
Sensirion AG |
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Series |
SHT1 |
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Packaging |
Cut Tape (CT) |
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Part Status |
Last Time Buy |
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Sensor Type |
Humidity, Temperature |
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Humidity Range |
0 ~ 100% RH |
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Output Type |
Digital |
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Output |
12b |
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Accuracy |
±4.5% RH |
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Response Time |
8s |
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Sensitivity |
- |
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Voltage - Supply |
2.4 V ~ 5.5 V |
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Mounting Type |
Surface Mount |
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Operating Temperature |
-40°C ~ 123°C |
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Package / Case |
10-SMD Module |
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Supplier Device Package |
10-LCC |
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Datasheet SHT1x (SHT10, SHT11, SHT15)
Humidity and Temperature Sensor IC
§ Fully calibrated
§ Digital output
§ Low power consumption
§ Excellent long term stability
§ SMD type package – reflow solderable
Product Summary
SHT1x (including SHT10, SHT11 and SHT15) is Sensirion’s family of surface mountable relative humidity and temperature sensors. The sensors integrate sensor elements plus signal processing on a tiny foot print and provide a fully calibrated digital output. A unique capacitive sensor element is used for measuring relative humidity while temperature is measured by a band-gap sensor. The applied CMOSens® technology guarantees excellent reliability and long term stability. Both sensors are seamlessly coupled to a 14bit analog to digital converter and a serial interface circuit. This results in superior signal quality, a fast response time and insensitivity to external disturbances (EMC).
Each SHT1x is individually calibrated in a precision humidity chamber. The calibration coefficients are programmed into an OTP memory on the chip. These coefficients are used to internally calibrate the signals from the sensors. The 2-wire serial interface and internal voltage regulation allows for easy and fast system integration. The tiny size and low power consumption makes SHT1x the ultimate choice for even the most demanding applications.
SHT1x is supplied in a surface-mountable LCC (Leadless Chip Carrier) which is approved for standard reflow soldering processes. The same sensor is also available with pins (SHT7x) or on flex print (SHTA1).
Dimensions
Figure 1: Drawing of SHT1x sensor packaging, dimensions in mm (1mm = 0.039inch). Sensor label gives “11” for SHT11 as an example. Contacts are assigned as follows: 1:GND, 2:DATA, 3:SCK, 4:VDD.
Sensor Chip
SHT1x V4 – for which this datasheet applies – features a version 4 Silicon sensor chip. Besides the humidity and temperature sensors the chip contains an amplifier, A/D converter, OTP memory and a digital interface. V4 sensors can be identified by the alpha-numeric traceability code on the sensor cap – see example “A5Z” code on Figure 1.
Material Contents
While the sensor is made of a CMOS chip the sensor housing consists of an LCP cap with epoxy glob top on an FR4 substrate. The device is fully RoHS and WEEE compliant, thus it is free of Pb, Cd, Hg, Cr(6+), PBB and PBDE.
1 Application Information
1.1 Operating Conditions
Sensor works stable within recommended normal range – see Figure 4. Long term exposures to conditions outside normal range, especially at humidity >80%RH, may temporarily offset the RH signal (+3 %RH after 60h). After return to normal range it will slowly return towards calibration state by itself. See Section 1.4 “Reconditioning Procedure” to accelerate eliminating the offset. Prolonged exposure to extreme conditions may accelerate ageing.
IMPORTANT: After soldering the devices should be stored at >75%RH for at least 12h to allow the polymer to re- hydrate. Otherwise the sensor may read an offset that slowly disappears if exposed to ambient conditions. Alternatively the re-hydration process may be performed at ambient conditions (>40%RH) during more than 5 days.
In no case, neither after manual nor reflow soldering, a board wash shall be applied. Therefore it is strongly recommended to use “no-clean” solder paste. In case of application with exposure of the sensor to corrosive gases or condensed water (i.e. environments with high relative humidity) the soldering pads shall be sealed (e.g. conformal coating) to prevent loose contacts or short cuts.
For the design of the SHT1x footprint it is recommended to use dimensions according to Figure 7. Sensor pads are coated with 35µm Cu, 5µm Ni and 0.1µm Au.2.47
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
Figure 4: Operating Conditions
1.2 Soldering instructions
For soldering SHT1x standard reflow soldering ovens may be used. The sensor is qualified to withstand soldering profile according to IPC/JEDEC J-STD-020D with peak temperatures at 260°C during up to 40sec including Pb- free assembly in IR/Convection reflow ovens.
Figure 6: Rear side electrodes of sensor, view from top side.
Figure 5: Soldering profile according to JEDEC standard. TP <= 260°C and tP < 40sec for Pb-free assembly. TL < 220°C and tL < 150sec. Ramp-up/down speeds shall be < 5°C/sec.
For soldering in Vapor Phase Reflow (VPR) ovens the peak conditions are limited to TP < 233°C during tP < 60sec and ramp-up/down speeds shall be limited to 10°C/sec. For manual soldering contact time must be limited to 5 seconds at up to 350°C7.
7 233°C = 451°F, 260°C = 500°F, 350°C = 662°F
Figure 7: Recommended footprint for SHT1x. Values in mm.
1.3 Storage Conditions and Handling Instructions
It is of great importance to understand that a humidity sensor is not a normal electronic component and needs to be handled with care. Chemical vapors at high concentration in combination with long exposure times may offset the sensor reading.
For these reasons it is recommended to store the sensors in original packaging including the sealed ESD bag at